| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and the manufacturing method which do not deteriorate electrical characteristics and prevent the peel ing of a copper pattern in a heat cycle and which are superior in reliability. SOLUTION: In a built-up multilayer printed wiring board, the copper patterns 4 and 5 and resin-insulating layers 2 are alternately laminated on a base material 1, and via holes 7 which electrically connect the copper patterns are formed in the resin insulating layer. In the copper pattern, projection and recess layers 11 are formed on the surface and a metal layer 20 constituted of the sulfide of copper is applied and formed on the projection and recess part. The metal layer 20 constituted of the sulfide of copper is applied/formed on the surface of the projecting and recessing layer 11 of the inner layer copper pattern 4. The inner layer copper pattern is applied, and the interlayer insulating layer 2 through adhesive for electroless plating is formed. The metal layer is partially exposed, the surface of the interlayer insulating layer is roughened by clouding agent and a catalyst core is given. Then, the outer layer copper pattern and the via holes are formed by electroless copper plating, so as to manufacture the wiring board. |
