发明名称
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of an aluminum conductor and an electronic part capable of forming a circuit having a low resistance, being inexpensive, and having excellent reliability in connection, a method thereof, an IC card using the connection structure, and a manufacturing method thereof. SOLUTION: The connection structure in which an aluminum conductor, conducting paste, adhesive, and an electronic part are connected in this order is provided. The connection method in which a part of the conducting paste is formed by overlapping a part of the aluminum conductor, the adhesive is superposed on the conducting paste, and the electronic part is superposed on the adhesive to heat and pressurized them is provided. The IC card in which an antenna circuit by means of the aluminum conductor, the conducting paste, anisotropic conducting adhesive, and the electronic part are connected in this order is provided. The manufacturing method for the IC card in which a part of the conducting paste is formed by overlapping a part of the antenna circuit by means of the aluminum conductor, the adhesive is superposed on the conducting paste, and the electronic part is superposed on the adhesive to heat and pressurized them, is provided.
申请公布号 JP4582373(B2) 申请公布日期 2010.11.17
申请号 JP20000230191 申请日期 2000.07.31
申请人 发明人
分类号 B42D15/10;G06K19/077;G06K19/07;H01L25/00;H01R4/04;H01R11/01 主分类号 B42D15/10
代理机构 代理人
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