| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamide resin for providing a polybenzoxazole resin, a polyimide resin or a copolymerized resin thereof excellent in adhesion to a substrate; a positive photosensitive resin composition using those and excellent in exposure properties; and a semiconductor device and a display component using the same. <P>SOLUTION: The positive photosensitive resin composition comprises the polyamide resin (A), a photosensitive diazonaphthoquinone compound (B) and an S-containing organosilicon compound (C). The semiconductor device and the display component using the same are also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
