发明名称 Systems and methods for curing a deposited layer on a substrate
摘要 Curing systems (20) are provided that include a planar support surface (22) for supporting a substrate (24) having at least one layer (26) deposited thereon, at least one curing device (28) for curing the at least one deposited layer, and a control system (32) for controlling the overall curing process. The curing device includes at least one laser (40), a lens module (42), and an optional modulator (44). During curing, the beam of light emitted from the laser may be directed onto the deposited layer by 1) controlling the position of an X-Y beam deflecting module to direct the focused beam of laser light onto a desired illumination area of the deposited layer; 2) controlling the position of the laser via an X-Y table (50), or 3) controlling the position of the substrate via an X-Y table (54).
申请公布号 EP2009969(A3) 申请公布日期 2010.11.17
申请号 EP20080252094 申请日期 2008.06.18
申请人 WEYERHAEUSER COMPANY 发明人 HIRAHARA, EDWIN;LEE, DAVID L.
分类号 H05K3/12;B23K26/08 主分类号 H05K3/12
代理机构 代理人
主权项
地址