SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to reduce the size of a device and implement high integration by reducing the width of a guide ring below the minimal width corresponding to a marginal aspect ratio. CONSTITUTION: A substrate(100) comprises a plurality of conductive structures and a wiring line. An interlayer insulation layer includes a fuse window(135). A fuse line(125) is electrically connected to the wiring line. A guard ring(180) prevent the entry of foreign materials and includes a protrusion member(150) separated from the body with a constant distance.