A PRINTED CIRCUIT BOARD COMPRISING A BUMP SUPPORITING PART AND A METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to implement a high density pattern by forming a bump through a coating or paste filling process. CONSTITUTION: A circuit layer is formed on an insulating layer(100) in order to transfer an electric signal. The circuit layer comprises an outer connection pad(110). A bump(500) is formed on the outer connection pad. A bump support part(300) surrounds the side of the bump so that the upper side of the bump is exposed. A solder resist layer(130) is formed on the insulating layer. The opening of the solder resist layer exposes the outer connection pad. A protective layer is formed on the upper side of the bump.