| 摘要 |
PURPOSE: A nickel-phosphorus-tungsten alloy electroless plating solution, an electroless plating process using the same, and a nickel-phosphorus-tungsten alloy plating layer prepared by the process are provided to prevent the diffusion of copper and improve thermal stability inside a plating layer by employing tungsten. CONSTITUTION: A nickel-phosphorus-tungsten alloy electroless plating solution comprises nickel sulfate as metal salt, sodium hyphophosphite as reducing agent, sodium tungstate as tungsten alloy source, and succinic acid, lactic acid, and citric acid as complexing agent, where the content of nickel sulfate is 20-30g/L, sodium tungstate 10-20g/L, succinic acid 5-20g/L, lactic acid 5-20g/L, and citric acid 5-10g/L. The plating liquid additionally also includes ammonia water as pH adjusting agent. |
