发明名称 |
Methods of securing a thermocouple to a ceramic substrate |
摘要 |
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.
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申请公布号 |
US7832616(B2) |
申请公布日期 |
2010.11.16 |
申请号 |
US20080970541 |
申请日期 |
2008.01.08 |
申请人 |
WATLOW ELECTRIC MANUFACTURING COMPANY |
发明人 |
LIN HONGY;SMITH JASON E.;BLOCK DANIEL J. |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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