发明名称 |
Semiconductor module and method of manufacturing the same |
摘要 |
A semiconductor module preferably includes a semiconductor package and a printed circuit board (PCB). The semiconductor package can include an outer terminal. The PCB can include a terminal land that is electrically connected to the outer terminal. The PCB preferably has a recess configured to at least partially expose the terminal land and to receive the outer terminal. The recess preferably has a width that is less than a width of the semiconductor package. Damage to edge portions of the semiconductor package whose outer terminal is received into the recess may be prevented, because the edge portions make contact with and are supported by the PCB. One or more support members can also be provided to contact one or more sides of the edge portions of the semiconductor package to further prevent damage due to horizontal impacts.
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申请公布号 |
US7834439(B2) |
申请公布日期 |
2010.11.16 |
申请号 |
US20070942552 |
申请日期 |
2007.11.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK SANG-WOOK;LEE SEUNG-JAE;YANG SEUNG-YEOL |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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