发明名称 |
Method for forming conductive structures |
摘要 |
A method of forming a method a conductive wire. The method includes forming a dielectric hardmask layer on a dielectric layer; forming an electrically conductive hardmask layer on the dielectric hardmask layer; forming a trench extending through the conductive and dielectric hardmask layers into the dielectric layer; depositing a liner/seed layer on the conductive hardmask layer and the sidewalls and bottom of the trench; filling the trench with a fill material; removing the liner/seed layer from the top surface of the conductive hardmask layer; removing the fill material from the trench; electroplating a metal layer onto exposed surfaces of the conductive hardmask layer and liner/seed layer; and removing the metal layer and the conductive hardmask layer from the dielectric hardmask layer so the metal layer and edges of the liner/seed layer are coplanar with the top surface of the dielectric hardmask layer.
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申请公布号 |
US7833893(B2) |
申请公布日期 |
2010.11.16 |
申请号 |
US20070775257 |
申请日期 |
2007.07.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRUNOW STEPHAN;KUMAR KAUSHIK A.;PETRARCA KEVIN SHAWN;VOLANT RICHARD PAUL |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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