发明名称 |
Features in substrates and methods of forming |
摘要 |
The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
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申请公布号 |
US7833426(B2) |
申请公布日期 |
2010.11.16 |
申请号 |
US20070803179 |
申请日期 |
2007.05.11 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CLARKE LEO C.;ASCHOFF CHRIS;ADDINGTON CARY G. |
分类号 |
G01D15/00;B23P17/00;B41J2/14;B41J2/16 |
主分类号 |
G01D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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