发明名称 Features in substrates and methods of forming
摘要 The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
申请公布号 US7833426(B2) 申请公布日期 2010.11.16
申请号 US20070803179 申请日期 2007.05.11
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 CLARKE LEO C.;ASCHOFF CHRIS;ADDINGTON CARY G.
分类号 G01D15/00;B23P17/00;B41J2/14;B41J2/16 主分类号 G01D15/00
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