发明名称 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
摘要 A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
申请公布号 US7833393(B2) 申请公布日期 2010.11.16
申请号 US20060373103 申请日期 2006.03.13
申请人 EBARA CORPORATION 发明人 YOSHIOKA JUNICHIRO;MUKAIYAMA YOSHITAKA
分类号 C25B9/00;B23H7/26;C25D7/12;H01L21/687 主分类号 C25B9/00
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