| 摘要 |
<p>PURPOSE: An apparatus for breaking a substrate is provided to cut the substrate by developing a crack along a preliminary cutting line through thermal impact. CONSTITUTION: A transfer unit(110) transfers a substrate(10) in a horizontal direction, and a preliminary cutting line is formed at a predetermined depth on the substrate through a scribe process. A heating chamber(120) is placed at the upper portion of the transfer unit, and the lower portion of the heating chamber is opened. Heating portions(130,140) are arranged inside the heating chamber, and heats the substrate. The substrate is cut along the preliminary cutting line through thermal impact.</p> |
