| 摘要 |
A semiconductor device (100) includes a semiconductor substrate (2), an inductor (4) provided on the semiconductor substrate (2), a metal ball (8) provided on the inductor (4) so as to come into contact with the inductor (4), and a bonding wire (10) electrically connected to the metal ball (8). The semiconductor device (100) exchanges signals with an external via the inductor (4) and the metal ball (8). The inductor (4) also serves as the bonding pad and therefore the inductor and the bonding pad need not to be arranged in pairs.
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