| 摘要 |
<p>The device has planar, face to face coupled and integrated structures (S1, S2), where one of the structures comprises a heating element (ECH) e.g. resistive element, on its face facing the other structure. The latter structure comprises an element network (ES) sensitive to temperature. An electric supply unit supplies power to the heating element, and an electrical measurement establishing unit establishes electrical measurements representing temperature distribution in the network to deduce measurement of relative alignment of the structures from the temperature distribution. An independent claim is also included for a method for measuring relative alignment of two planar, face to face coupled and integrated structures.</p> |
