首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MULTI-LAYER THICK METALLIZATION STRUCTURE FOR A MICROELECTRONIC DEVICE, INTEGRATED CIRCUIT CONTAINING SAME, AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT CONTAINING SAME
摘要
申请公布号
KR20100120224(A)
申请公布日期
2010.11.12
申请号
KR20107021330
申请日期
2009.06.08
申请人
INTEL CORPORATION
发明人
LEE KEVIN J.
分类号
H01L21/3205;H01L21/28
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Flexible tubular member with sealed tape layer
Mobile radio communication device
Rotary printing machine with first and second side wall elements
A GEMSTONE POLISHING DEVICE AND A METHOD OF POLISHING
LOCAL THUMBNAIL CACHE
TRICK PLAY RESISTANT AD INSERTION
NASAL VACCINE
MEMS FLUID SENSOR
COMMUNICATIONS NETWORK SYSTEM AND METHODS FOR USING SAME
RECEIVING APPARATUS
MICROWAVE DEVICES FOR TREATING BIOLOGICAL SAMPLES AND TISSUE AND METHODS FOR USING THE SAME
Parenteral formulations comprising boronic acid species for selective thrombin inhibition
ACOUSTIC LOADING DEVICE FOR LOUDSPEAKERS
Bilateral machine for processing glass panes shaped like a parallelogram with non-right angles
Method and system for reordered QRV-LST (layered space time) detection for efficient processing for multiple input multiple output (MIMO) communication systems
Process for isolating nucleic acids
Candle and candle production process.
Supporting device
SYSTEM AND METHOD FOR DETECTING A PROXY BETWEEN A CLIENT AND A SERVER
A method for reducing nitrogen oxide emissions of a recovery boiler, and a recovery boiler
