发明名称 METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface acoustic wave element, capable of efficiently, highly accurately and easily manufacturing a surface acoustic wave element. <P>SOLUTION: The method for manufacturing the surface acoustic wave element includes: (a) a substrate thickness reduction step of reducing the thickness of a piezoelectric substrate 10, by machining one principal surface 10b of the piezoelectric substrate 10; and (b) a bonding step of bonding a support substrate 14, having a smaller coefficient of linear expansion than that of the piezoelectric substrate 10 via a resin adhesive 12 to the piezoelectric substrate 10 having the reduced thickness. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010259000(A) 申请公布日期 2010.11.11
申请号 JP20090109832 申请日期 2009.04.28
申请人 MURATA MFG CO LTD 发明人 OMURA MASASHI;RYU YOSHITAKE;HORIKAWA HARUNOBU
分类号 H03H3/08;H01L21/02;H01L41/09;H01L41/18;H01L41/22;H01L41/313;H01L41/337;H03H9/145;H03H9/25 主分类号 H03H3/08
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