| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a surface acoustic wave element, capable of suppressing warping and peeling of the substrate during manufacturing processes of the surface acoustic wave element, and to provide a method of manufacturing the surface acoustic wave element. <P>SOLUTION: The substrate for the surface acoustic wave element includes (a) a piezoelectric substrate 12 and (b) a support substrate 14 whose one of the principal surfaces 14a is pasted on a principal surface 12b of the piezoelectric substrate 12 and whose linear expansion coefficient is smaller than that of the piezoelectric substrate 12. The principal surface 14a of the support substrate 14 is larger than the principal surface 12b of the piezoelectric substrate 12. As seen through from the direction normal to the pasting plane between the supporting substrate 14 and the piezoelectric substrate 12, the piezoelectric substrate 12 is disposed inside the support substrate 14 so that the supporting substrate 14 has an extruding portion 13 that surrounds the outside of the piezoelectric substrate 12. <P>COPYRIGHT: (C)2011,JPO&INPIT |
