| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board resin composition preventing delamination and fine cracks by increasing toughness, excellent in thermal safety and mechanical strength, capable of exhibiting a high peeling off strength value by an existing board manufacturing step and excellent in resistance relative to heat impact, and a printed circuit board using this. SOLUTION: The resin composition includes a composite epoxy resin containing a bisphenol A type epoxy resin in which silicone elastomer particles 10 of a core-shell structure are dispersed in a DGEBA type epoxy resin, a cresol novolak epoxy resin and a phosphoric epoxy resin, a bisphenol A type curing agent, a curing accelerator, and an inorganic filler. COPYRIGHT: (C)2011,JPO&INPIT
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