发明名称 CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive particulate hardly causing breaking due to destruction or the like at a connection interface between an electrode and itself and capable of achieving high connection reliability, and also to provide an anisotropic conductive material formed by using the conductive particulate, and further to provide a connecting structure. SOLUTION: The conductive particulate has a low melting point metal layer formed on a surface of a base material particulate. A resin fine particulate smaller than the particulate diameter of the base material particulate is included in the low melting point metal layer. The resin fine particulate has an average particulate diameter that is 15%-75% of the thickness of the low melting point metal layer and the content thereof is 2-15 vol%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010253507(A) 申请公布日期 2010.11.11
申请号 JP20090106474 申请日期 2009.04.24
申请人 SEKISUI CHEM CO LTD 发明人 SASAKI HIROSHI
分类号 B23K35/14;B22F1/00;B22F1/02;B23K35/26;B23K35/363;H01B1/22;H01B5/00;H01R11/01;H05K3/32 主分类号 B23K35/14
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