| 摘要 |
A semiconductor device includes a low-side circuit, high-side circuit, a virtual ground potential pad, a common ground potential pad and a diode, formed on a semiconductor substrate. The low-side circuit drives a low-side power transistor. The high-side circuit is provided at a high potential region, and drives a high-side power transistor. The virtual ground potential pad is arranged at the high potential region, and coupled to a connection node of both power transistors to supply a virtual ground potential to the high-side circuit. The common ground potential pad supplies a common ground potential to the low-side circuit and high-side circuit. The diode has its cathode connected to the virtual ground potential pad and its anode connected to the common ground potential pad.
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