METHOD FOR MANUFACTURING AN FPCB USING A BONDING SHEET

摘要

According to the present invention, a method for manufacturing an FPCB using a bonding sheet including a substrate portion having a substrate mounted thereon, and a bending portion to be bent, comprises the steps of: forming a circuit pattern on a copper foil surface of a copper clad laminate; removing a first release film of the bonding sheet having said first release film and a second release film attached to an adhesive layer on either surface thereof; stacking the bonding sheet on the circuit pattern formed on the substrate portion and the bending portion, such that the adhesive layer is opposite the bonding sheet; and removing the second release film of the stacked bonding sheet. According to the present invention, a bonding sheet is used on a bending portion of an FPCB, as opposed to the solder mask ink of the prior art, such that low repulsive forces can be provided and costs can be reduced through a simple process as compared to said solder mask ink printing process.