发明名称 |
CIRCUIT AND PHOTO SENSOR OVERLAP FOR BACKSIDE ILLUMINATION IMAGE SENSOR |
摘要 |
<p>A backside illuminated (“BSI”) imaging sensor pixel includes a photodiode region and pixel circuitry. The photodiode region is disposed within a semiconductor die for accumulating an image charge in response to light incident upon a backside of the BSI imaging sensor pixel. The pixel circuitry includes transistor pixel circuitry disposed within the semiconductor die between a frontside of the semiconductor die and the photodiode region. At least a portion of the pixel circuitry overlaps the photodiode region.</p> |
申请公布号 |
KR20100119860(A) |
申请公布日期 |
2010.11.11 |
申请号 |
KR20107017059 |
申请日期 |
2009.02.02 |
申请人 |
OMNIVISION TECHNOLOGIES, INC. |
发明人 |
DAI TIEJUN;TAI HSIN CHIH;MANABE SOHEI;NOZAKI HIDETOSHI;RHODES HOWARD E. |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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