发明名称 ALIGNER APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an aligner apparatus holding the edge of a wafer and centering the wafer and aligning the angles of the notches of the wafer, including an infinite rotatable mechanism which is not limited by a rotating range, formed by eliminating cable and tubes from a rotating portion for reducing the tact time and the size. SOLUTION: A linking mechanism openably operating a holding mechanism holding the wafer (1) is formed, supported on a linking mechanism drive part driving the link mechanism via a bearing (14) so that only the holding mechanism and the linking mechanism can be rotated. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010258480(A) 申请公布日期 2010.11.11
申请号 JP20100182233 申请日期 2010.08.17
申请人 YASKAWA ELECTRIC CORP 发明人 YOSHINO KEISUKE;HAGIO MITSUAKI;OSAKI MAKOTO;KUSAMA YOSHIHIRO
分类号 H01L21/68 主分类号 H01L21/68
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