| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simply and accurately detect occurrence of cracks in a semiconductor device and to make control according to detection results. <P>SOLUTION: A semiconductor device is provided with the semiconductor device which is bonded to a substrate in a metal joint. In the peripheral region of the semiconductor device, a thermistor element 160 in which an electric resistance changes according to a temperature is provided, and is connected to a control electrode 122 of a transistor element 120. When there occurs abnormal heat generation due to cracks in the joint, the resistance of the thermistor element 160 changes to control the operation state of the transistor element 120. The operation of the semiconductor device is stopped thereby at an abnormal temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
