发明名称 METHOD AND APPARATUS FOR INSPECTING DEFECT
摘要 PROBLEM TO BE SOLVED: To provide a method of inspecting defects and a defect inspection apparatus for detecting defects with high sensitivity and a high capture rate even on diverse patterns existing on a wafer. SOLUTION: In the defect inspection apparatus, an illuminating optical system includes two systems, namely a coherent illumination system using a laser 5 and an incoherent illumination system using LEDs 6a, 6b, 6c, 6d. A detection system is branched into optical paths corresponding to each illumination light; spatial modulation elements 55a, 55b are disposed in the detection optical paths, respectively; scattering light disturbing sensitivity is blocked by the spatial modulation elements 55a, 55b; and the scattering light having passed through the spatial modulation elements 55a, 55b is detected by image sensors 90a, 90b disposed in the optical paths, respectively. Then, the images detected by the two image sensors 90a, 90b are compared with each other to determine a defect candidate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010256148(A) 申请公布日期 2010.11.11
申请号 JP20090105913 申请日期 2009.04.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SHIBATA YUKIHIRO;NAKADA TOSHIHIKO;UENO TAKETO;TANIGUCHI ATSUSHI;HONDA TOSHIFUMI
分类号 G01N21/956 主分类号 G01N21/956
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