| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board having high dimensional accuracy, suppressing an increase in the capacitance between wiring layers while suppressing an occurrence of voids near the center of a glass ceramic green sheet layered product. SOLUTION: In a method for manufacturing a multilayer wiring board, a glass ceramic green sheet layered product 5 formed by laminating a plurality of layers of first glass ceramic green sheets 11-14 and second glass ceramic green sheets 21-23 is burned wherein the second glass ceramic green sheets start burning shrinkage at temperature higher than temperature in the end of burning shrinkage of the first glass ceramic green sheets. The thickness of the first glass ceramic green sheets 11-14 after burning is set to be 1/3 or less of the thickness of the second glass ceramic green sheets 21-23 after burning. Only the first glass ceramic green sheets 11-14 are arranged so as to contain high dielectric constant particles. The content of the high dielectric constant particles is made to be gradually increased toward the inside from the outside of the laminating direction of the glass ceramic green sheet layered product 5, and the glass ceramic green sheet layered product is heated using a microwave. COPYRIGHT: (C)2011,JPO&INPIT |
