| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of reducing particles attributable to a peel of a sputter film by improving a deposition preventive plate for preventing a sputter-deposition film (sputter film) from being peeled. SOLUTION: A deposition preventive plate 107 is installed on a peripheral part of a substrate 101 so as to be opposite to a target 104, and a plurality of recessed faces 105a, 105b, 108, 110 are formed on a surface of the deposition preventive plate 107. Grooves 106a-106c are formed in joints of the recessed faces 105a, 105b, 108, 110. A sputter film is deposited inside the recessed faces 105a, 105b, 108, 110 and the grooves 106a-106c. Any peel of the sputter film from the deposition preventive plate 107 is prevented by allowing the sputter film to be surrounded inside the recessed faces 105a, 105b, 108, 110 and compressed after the sputtering is completed. COPYRIGHT: (C)2011,JPO&INPIT |
