| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element which is improved in reliability by stabilizing processes while actualizing simple manufacturing processes, and to provide a method of manufacturing the same. SOLUTION: The semiconductor element includes, on a substrate 10, a semiconductor layer 20 which includes an active layer 12 and having a striped ridge 14 formed on a surface, and an electrode 15 which is formed on the ridge 14, wherein the electrode 15 comes into contact with the semiconductor layer 20 and only the upper surface of the ridge 14, and is wider than the upper surface of the ridge 14, and a protection film 16 having an opening at the upper surface of the ridge 14 is formed from side faces of the ridge 14 to the upper surface of the electrode 15. COPYRIGHT: (C)2011,JPO&INPIT |
