| 发明名称 |
FILM-LIKE ADHESIVE AGENT FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE |
| 摘要 |
A film-like adhesive agent for sealing a semiconductor, which comprises (a) an epoxy resin and (b) a catalyst-type curing agent and does not contain any curing agent that can be converted into an active species by the action of the catalyst-type curing agent or can react with the catalyst-type curing agent. |
| 申请公布号 |
WO2010128611(A1) |
申请公布日期 |
2010.11.11 |
| 申请号 |
WO2010JP56004 |
申请日期 |
2010.04.01 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;HONDA KAZUTAKA;ENOMOTO TETSUYA;NAKAMURA YUUKI |
发明人 |
HONDA KAZUTAKA;ENOMOTO TETSUYA;NAKAMURA YUUKI |
| 分类号 |
C09J7/00;C09J11/06;C09J163/00;H01L21/60 |
主分类号 |
C09J7/00 |
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