| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique by which size variation between semiconductor device products is suppressed when semiconductor devices are manufactured by using a plurality of the same type of manufacturing apparatuses. <P>SOLUTION: A control device CD is disposed separately for each exposure unit. Lots having been subjected to an exposure process are classified depending on which exposure units are used for the lots in the exposure process. For each exposure unit, a product information collecting unit CD1 collects parameters for adjusting the exposure unit, and an optimum manufacturing condition calculating unit CD2 calculates a processing condition to set the calculated condition. As the exposure unit that carries out the exposure process is assigned to every lot in advance, a lot not yet subjected to the exposure process is allocated to an assigned exposure unit by a classifying machine CM, and exposure unit carries out the exposure process under a processing condition determined by the control device CD. <P>COPYRIGHT: (C)2011,JPO&INPIT |
