| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of enhancing the rate of effective utilization of a target as compared to a case of using the target in which a surface to be sputtered is formed flat. SOLUTION: The sputtering apparatus 1 includes: a stage 4 for supporting a substrate 3 for film deposition; and a target 5 which is provided with a surface 5a to be sputtered being opposite to the substrate 3 supported by the stage 4 while one surface thereof is the surface 5a to be sputtered. The surface 5a to be sputtered of the target 5 is formed in a mortar shape. COPYRIGHT: (C)2011,JPO&INPIT
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