发明名称 WAFER SCALE ARRAY OF OPTICAL PACKAGE AND METHOD FOR FABRICATING THE SAME
摘要 A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.
申请公布号 US2010283113(A1) 申请公布日期 2010.11.11
申请号 US20090812357 申请日期 2009.01.12
申请人 INDUSTRY-ACADEMIC CO-OPERATION FOUNDATION, YONSEIUNVERSITY 发明人 KANG SHINILL;LIM JI SEOK;CHOI MIN SEOK;KIM HO KWAN
分类号 H01L31/0232;G02B7/02;H01L31/18 主分类号 H01L31/0232
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