发明名称 |
WAFER SCALE ARRAY OF OPTICAL PACKAGE AND METHOD FOR FABRICATING THE SAME |
摘要 |
A wafer-scale array of optical packages and a method for fabricating the same. The wafer-scale array of optical packages includes at least one wafer-scale array of lens structures, including a wafer-scale array of first barrel structures and a wafer-scale array of lenses directly formed on the wafer-scale array of first barrel structures such that the wafer-scale array of lenses is integrally combined with the wafer-scale array of first barrel structures, the wafer-scale array of first barrel structures being made of a material different from a material of the lens of the wafer-scale array of lenses; and at least one wafer-scale array of second barrel structures stacked on and combined with the at least one wafer-scale array of lens structures.
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申请公布号 |
US2010283113(A1) |
申请公布日期 |
2010.11.11 |
申请号 |
US20090812357 |
申请日期 |
2009.01.12 |
申请人 |
INDUSTRY-ACADEMIC CO-OPERATION FOUNDATION, YONSEIUNVERSITY |
发明人 |
KANG SHINILL;LIM JI SEOK;CHOI MIN SEOK;KIM HO KWAN |
分类号 |
H01L31/0232;G02B7/02;H01L31/18 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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