PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is superior in folding endurance even after an IR reflow process, and to provide a flexible circuit board employing the same, and to provide a method of manufacturing the circuit board.

SOLUTION: The photosensitive resin composition includes: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of ≥10% and a 2% weight loss temperature of ≥260°C after being cured.

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