| 摘要 |
PROBLEM TO BE SOLVED: To provide a design device for providing a three-dimensional integrated circuit that includes a logic module chip and a memory array chip with high performance. SOLUTION: The design device 100 includes: an input part 101 for inputting logic module information about a logic module; a memory block configuration part 103 for generating memory block configuration information showing a configuration of the memory block on the basis of logic module information; a logic module placement part 102 for placing a logic module on a logic module chip on the basis of logic module information; a memory block assignment part 104 for assigning a memory block to a plurality of memory elements mounted on a memory array chip on the basis of the memory block configuration information generated by the memory block configuration part 103; and an output part 105 for outputting placement of the logic module and the assignment of the memory block as a design result. COPYRIGHT: (C)2011,JPO&INPIT
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