| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive composition for temporarily fixing a wafer which is suitable for the application in which a silicon wafer is temporarily fixed to a holding material, has achieved excellent adhesiveness between the holding material and the wafer, and is excellent in heat resistance. SOLUTION: The heat-resistant adhesive composition for temporarily fixing a wafer includes a polymer having a repeating unit represented by general formula (I) or (II), wherein Y is an aromatic diamide or an aromatic amide imide, and Y may be different for each repeating unit. COPYRIGHT: (C)2011,JPO&INPIT
|
