| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which complies with the demand for improvement in reliability. SOLUTION: The wiring board 3 includes a base 7 having a through-hole T, a through-hole conductor 9 formed in the through-hole T, and a ceramic structure 8 interposed between the base 7 and the through-hole conductor 9. The method of manufacturing the wiring board 3 includes the steps of: preparing the base 7 having the through-hole T; coating an inner wall of the through-hole T with ceramic sol containing ceramic particles and a solvent; forming the ceramic structure 8 including ceramic particles by drying the solvent; and forming the through-hole conductor 9 in the through-hole T. COPYRIGHT: (C)2011,JPO&INPIT |
