| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for lengthening a service life of a carrier for storing the polished objects. <P>SOLUTION: This method of manufacturing a polishing product includes a step for holding the carrier 100 for storing a wafer W between an upper surface plate 11 and a lower surface plate 14, and a step for polishing an upper surface or a lower surface of the wafer W by moving carrier 100 held between the upper surface plate 11 and the lower surface plate 14 relatively to the upper surface plate 11 and the lower surface plate 14. In the carrier 100 formed with a plurality of workpiece holes 102 for storing the wafer W, storing possible area of the wafer W to area occupied by the carrier 100 is made 60% or more. <P>COPYRIGHT: (C)2011,JPO&INPIT |
