发明名称 BONDED MOLDING AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To increase the bonding strength of an inserted part in a bonded molding obtained by inserting the solid matter of a semi-solidified slurry into the edge part of a workpiece. SOLUTION: A workpiece 42 is molded into a shape corresponding to the shape of a frame member 18 for the second door by the first die 44 and the first punch 46 in a die device 40, and thereafter, a semi-solidified slurry 48 is pressed by the second die 50 and the second punch 52. The semi-solidified slurry 48 crushed by the pressing flows so as to orient to the frame member 18 for the second door projected toward the side of the semi-solidified slurry 48. When the flowing progresses, the edge parts of the frame member 18 for the second door break through oxide films present on the surface of the semi-solidified slurry 48, and are buried into the semi-solidified slurry 48, i.e., the parts free from the presence of the oxide films. At this time, since the semi-solidified slurry 48 slides while pressing both the edge faces of the frame member 18 for the second door, the oxide films present on the edge faces are broken as well. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010253523(A) 申请公布日期 2010.11.11
申请号 JP20090108382 申请日期 2009.04.27
申请人 HONDA MOTOR CO LTD 发明人 MATSUMOTO KATSUYA;WATANABE SUMITOMO;MORITA TAKAHIRO;KANEKO MITSUGI;MURAKAWA TOSHIHIRO
分类号 B22D19/04;B22D18/02 主分类号 B22D19/04
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