发明名称 MULTIPLE PATTERNING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of preventing waste of a board material by making a cut region narrow, and effectively preventing the occurrence of flaws, dents, adhesion or the like to both surfaces of each product region when a plurality of the multiple patterning wiring boards are stacked on one another, and stably stackable by preventing the plurality of multiple patterning wiring boards from easily sliding on one another. SOLUTION: In the multiple patterning wiring board 10, a plurality of product regions 3 each becoming a compact wiring board are arranged and formed side by side in a central part by interposing cut regions 4 therebetween, and a frame-like margin region 5 surrounding the central part is formed in an outer peripheral part. Projecting parts 7 having heights projecting from upper and lower surfaces of the product regions 3 and each formed of solder resist are formed on the upper and lower surfaces of at least either of the cut regions 4 and the margin regions 5. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010258389(A) 申请公布日期 2010.11.11
申请号 JP20090110055 申请日期 2009.04.28
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 KITAMURA TETSUYA
分类号 H05K3/28;H05K1/02;H05K3/00 主分类号 H05K3/28
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