发明名称 |
MOLD FOR FORMING LED PACKAGE |
摘要 |
The present invention relates to a mold for forming an LED lens having a novel structure, which enables the easy injection of resin and prevents residuals from remaining around a reflector during a lens molding process. According to the present invention, when an intermediate panel (14) is coupled onto the upper portion of a substrate (1) such that a reflector (3) is fitted into a through-hole (14a), a stopper protrusion (14b) formed at the through-hole (14a) presses the circumference of the upper surface of the reflector (3) to divide the upper surface and the circumference of the reflector (3). Thus, resin introduced into a cavity (13) through a runner (11) and a gate (12) is leaked onto the circumference of the reflector (3), to thereby prevent residuals from remaining around the reflector, and the cross-section area of the gate (12) is widened to enable easy injection of the resin. |
申请公布号 |
WO2010095841(A3) |
申请公布日期 |
2010.11.11 |
申请号 |
WO2010KR00948 |
申请日期 |
2010.02.16 |
申请人 |
CHAMTECH CO., LTD.;LEE, KYUNG JOON;JEONG, DAE SUNG |
发明人 |
LEE, KYUNG JOON;JEONG, DAE SUNG |
分类号 |
B29D11/00 |
主分类号 |
B29D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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