发明名称 MOLD FOR FORMING LED PACKAGE
摘要 The present invention relates to a mold for forming an LED lens having a novel structure, which enables the easy injection of resin and prevents residuals from remaining around a reflector during a lens molding process. According to the present invention, when an intermediate panel (14) is coupled onto the upper portion of a substrate (1) such that a reflector (3) is fitted into a through-hole (14a), a stopper protrusion (14b) formed at the through-hole (14a) presses the circumference of the upper surface of the reflector (3) to divide the upper surface and the circumference of the reflector (3). Thus, resin introduced into a cavity (13) through a runner (11) and a gate (12) is leaked onto the circumference of the reflector (3), to thereby prevent residuals from remaining around the reflector, and the cross-section area of the gate (12) is widened to enable easy injection of the resin.
申请公布号 WO2010095841(A3) 申请公布日期 2010.11.11
申请号 WO2010KR00948 申请日期 2010.02.16
申请人 CHAMTECH CO., LTD.;LEE, KYUNG JOON;JEONG, DAE SUNG 发明人 LEE, KYUNG JOON;JEONG, DAE SUNG
分类号 B29D11/00 主分类号 B29D11/00
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