PACKAGING MATERIALS WITH ENHANCED THERMAL-INSULATING PERFORMANCE

摘要

A packaging material with enhanced thermal-insulating performance is disclosed that includes a paper-based substrate and a thermal-insulating layer positioned on at least one surface of the substrate. The thermal-insulating layer contains void structure and is derived from a fluid thermal-insulating composition comprising: 20% to 70% weight of filler; 15% to 70% weight of organic binder; 0.5% to 10 weight of plasticizer; and 10% to 15% weight of moisture, based on the total thermo-insulating composition weight. When desired, the disclosed packaging material may further include a paper-based top layer such that the thermal-insulating layer is positioned between the paper-based substrate and the paper-based top layer. The disclosed packaging material may be used in the formation of thermo-insulating containers such as food bowls and beverage cups, as well as the sleeve components to impart thermo-insulating performance to packaging containers.