发明名称 PRESSURE-BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To attempt to avoid an interference between a trim body and a skin set guide when pressure-bonding molding is performed. SOLUTION: The skin set guide 8 is lowered to a position where the upper end comes into non-contact with the trim body T by a lowering means 13 when the trim body T and the skin S are stuck together through pressure-bonding, to avoid the direct interference between the surface of the trim body T and the upper end of the skin set guide 8. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010253734(A) 申请公布日期 2010.11.11
申请号 JP20090104447 申请日期 2009.04.22
申请人 KASAI KOGYO CO LTD 发明人 KITAMURA NORIYUKI
分类号 B29C65/78;B29C63/04 主分类号 B29C65/78
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