HEAT DISSIPATION MATERIAL, PRINTED BOARD, AND METHOD FOR MANUFACTURING PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipation material with improved heat dissipation properties, a printed board, and a method for manufacturing the printed board. SOLUTION: The heat dissipation material includes an insulating substrate 11 and a heat dissipation layer 12. The insulating substrate 11 includes a surface 11a. The heat dissipation layer 12 is formed on the insulating substrate 11 and includes a first layer 16 having a graphene structure whose vertical direction to the surface 11a of the insulating substrate 11 is c axis and a second layer 17 whose lengthwise direction is oriented in a direction vertical to the surface 11a of the insulating substrate 11, having a nano-tube shape. COPYRIGHT: (C)2011,JPO&INPIT