| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate transfer mechanism for fully cooling substrates during transport which is heated in a film-forming device. SOLUTION: The substrate transport mechanism has an array of a first substrate holding member 62a, consisting of suckers and an array of a second substrate holding member 62b consisting of Bernoulli Chucks, and a substrate removable holder 62. The substrate transport mechanism holds the array of film formed substrates 6b on a tray 4 with a second substrate holding member 62b, while holding the array of substrates 6a on a carrying in conveyor 70, before film forming with a first substrate holding member 62a; holds the array of substrates 6a on a carrying in conveyor 70; before film forming with the first substrate holding member 62a; after mounting the substrates 6a held with the first substrate holding member 62a; before film forming on the tray 4; and mounts the film formed substrates 6b, held by the second substrate holding member 62b on a carrying out conveyor 72. COPYRIGHT: (C)2011,JPO&INPIT |
