| 摘要 |
PROBLEM TO BE SOLVED: To form a high density and fine pattern and to improve reliability of interlayer connection while a board on which a circuit pattern is formed is thinned and flattened. SOLUTION: A conductive layer 4A is laminated on a support member 4B so as to prepare a plate. A first conductor circuit 2a and a post 3a, which are formed in a first plate, and a second conductor circuit 2b formed on a second plate are located in necessary positions while an insulating substrate 1 is intervened, and are heated and pressurized. The first conductor circuit 2a is buried on one face side of the insulating substrate 1 and the second conductor circuit 2b on the other face side of the insulating substrate. The post 3a penetrating a post through-hole 1c electrically connects the first conductor circuit 2a with the second conductor circuit 2b by inter-metal coupling. The insulating substrate 1 is cured, and the plate comprising the conductive layer is removed so that a printed board is manufactured. COPYRIGHT: (C)2011,JPO&INPIT |
