COMPOSITE BODY, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a composite body including fine wiring lines and vias which are formed in a resin layer of the composite body and have high adhesion, high reliability and suitability for high frequencies; a method for manufacturing the same; and a semiconductor device. SOLUTION: The first composite body 100 including a resin layer 1 and conductor layers 2 includes grooves 3 each having a maximum width of 1-10μm on a surface of the resin layer 1 and the conductor layers 2 provided in the grooves 3, wherein arithmetic average roughness (Ra) of the surface of the resin layer 1 in contact with the conductor layer 2 is 0.05-0.45μm; and/or the resin layer 1 includes via holes each having a diameter of 1-25μm, and conductor layers 2 are provided in the via holes. Arithmetic average roughness (Ra) of the surface of the resin layer 1 in the via hole is 0.05-0.45μm. COPYRIGHT: (C)2011,JPO&INPIT