| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module facilitating handling to a metal housing and having a high shielding characteristic, to provide a method of manufacturing the same, and to provide an electronic apparatus with the high-frequency module mounted thereon. SOLUTION: This high-frequency module 1 includes: a printed wiring board 10; first-mounting-form circuit components 11 mounted on the printed wiring board 10 in a first mounting form; a second-mounting-form circuit component 12 mounted on the printed wiring board 10 in a second mounting form different from the first mounting form; and a metal housing 20 covering the first-mounting-form circuit components 11 and the second-mounting-form circuit component 12. The metal housing 20 includes connection terminal parts 23 delimited by cutout parts 21 formed by cutting out side faces 20s of the metal housing 20 and connected to the printed wiring board 10, and partial parts of the first-mounting-form circuit components 11 are arranged corresponding to the cutout parts 21. COPYRIGHT: (C)2011,JPO&INPIT |
