发明名称 POLISHING APPARATUS AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To shorten a time required to transfer a conditioning disc so that it is cleaned or moistened, and to prevent a solid substance attached to the conditioning disc from being swept out to a workpiece side by the conditioning disc. <P>SOLUTION: The polishing apparatus 1 is equipped with: a polishing table 3 having a polishing pad 2 on an upper surface thereof; the conditioning disc 4 for performing conditioning of the polishing pad 2; a moving mechanism (consisting of, for example, a swing arm 5 and the like) moving the conditioning disc 4 to a stand-by position W located in the upper part of the polishing pad 2; and a spraying mechanism (consisting of, for example, a cleaning water nozzle 6 and the like) cleaning or moistening the conditioning disc 4 by jetting the liquid against the conditioning disc 4 which is positioned in the stand-by position W. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010253637(A) 申请公布日期 2010.11.11
申请号 JP20090108192 申请日期 2009.04.27
申请人 RENESAS ELECTRONICS CORP 发明人 SHIRATANI MASASHI;YOSHIDA SHIGEYUKI;ITO OSAMU
分类号 B24B53/017;H01L21/304 主分类号 B24B53/017
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