发明名称 METHOD FOR MANUFACTURING FLOOR PANEL, AND THE FLOOR PANEL
摘要 PROBLEM TO BE SOLVED: To keep the amount of deformation of the whole floor panel small by suppressing the displacement between upper and lower plates when a load is imposed on them. SOLUTION: The upper metal plate 3 and the lower metal plate 7 having a recess 5 provided on the side facing the upper plate 3 overlap each other; and a welded zone 27 is formed by applying spot welding to the flange 25 of the upper plate 3 and a flange 13 of the lower plate 7. After the spot welding, edge bending work is performed by bending an edge bending portion 23 on a leading end side with respect to the flange 25 of the upper plate 3 so as to make it overlap the flange 13 of the lower plate 7. In this case, the edge bending portion 23 covers the welded zone 27. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010255199(A) 申请公布日期 2010.11.11
申请号 JP20090103087 申请日期 2009.04.21
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 HIRATA OSAMU;ASAKI SEIYA;UEDA TAKUSANE;MIYAKE SEITA
分类号 E04F15/024 主分类号 E04F15/024
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